发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.
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申请公布号 |
US2011266664(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US20100772142 |
申请日期 |
2010.04.30 |
申请人 |
SHEN GUO QIANG;YEE JAE HAK;ZHU DENVER |
发明人 |
SHEN GUO QIANG;YEE JAE HAK;ZHU DENVER |
分类号 |
H01L25/065;H01L21/50;H01L23/52 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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