INTEGRATED-TERMINAL-TYPE METAL BASE PACKAGE MODULE AND A METHOD FOR PACKAGING AN INTEGRATED TERMINAL FOR A METAL BASE PACKAGE MODULE

摘要

The present invention relates to a method for packaging an integrated terminal for a metal base package module which effectively prevents a short circuit or damage by not using wire bonding to connect to an external circuit. The method includes: preparing a metal substrate formed from a conductive metal material; forming an oxide layer by oxidizing the top surface of the metal substrate to a predetermined depth; forming an insulation groove of a uniform width along the edge and from the bottom surface of the metal substrate to the oxide layer; forming a plurality of external connection terminals at intervals along the edge by removing an edge portion of the metal substrate which is disconnected from the middle portion by the insulation groove; mounting an electronic component on the metal substrate or the oxide layer and electrically connecting the electronic component with an external connection terminal.