SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING THIN FILM

摘要

Disclosed is a substrate processing apparatus wherein adhesion of dusts on a film applied on a substrate can be suppressed. The substrate processing apparatus is provided with: a spin-coating chamber (4a) wherein the film is applied on the substrate by spin-coating; a first air-conditioning mechanism, which adjusts the quantity of dusts in the air in the spin-coating chamber; an annealing chamber (7a) wherein the film applied on the substrate is lamp-annealed; a transfer chamber (2a), which is connected to the spin-coating chamber and the annealing chamber, and which transfers the substrate between the spin-coating chamber and the annealing chamber; and a second air-conditioning mechanism, which adjusts the quantity of dusts in the air in the transfer chamber.