| 摘要 |
<p>Disclosed is an inspecting apparatus (1) which is provided with: a stage (5) that supports a wafer (10) having a predetermined pattern formed on the surface by being exposed by means of an exposure apparatus; an illuminating system (20), which applies illuminating light to the surface of the wafer (10) supported by the stage (5); an image pickup device (35), which detects light outputted from the surface of the wafer (10) having the illuminating light applied thereto; and an image processing section (40) wherein, using focus conditions, which are set by a certain exposure apparatus, and which are to be reference, or using an exposure quantity to be reference, an adjustment value of focus conditions or that of the exposure quantity of a different exposure apparatus (60) is calculated, on the basis of information of light outputted from the surface of the wafer (10) exposed by the different exposure apparatus (60), said light being detected by means of the image pickup device (35).</p> |
