发明名称 |
CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL |
摘要 |
A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm2.
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申请公布号 |
US2011267791(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US20080671804 |
申请日期 |
2008.07.31 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TOMISAKA KATSUHIKO;KOBAYASHI KOUJI;TAKETATSU JUN;ARIFUKU MOTOHIRO;KOJIMA KAZUYOSHI;MOCHIZUKI NICHIOMI |
分类号 |
H05K7/00;B32B5/16;H01R43/00;H05K1/09 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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