发明名称 PROCESS CHAMBERS HAVING SHARED RESOURCES AND METHODS OF USE THEREOF
摘要 Process chambers having shared resources and methods of use are provided. In some embodiments, substrate processing systems may include a first process chamber having a first substrate support disposed within the first process chamber, wherein the first substrate support has a first heater and a first cooling plate to control a temperature of the first substrate support; a second process chamber having a second substrate support disposed within the second process chamber, wherein the second substrate support has a second heater and a second cooling plate to control a temperature of the second substrate support; and a shared heat transfer fluid source having an outlet to provide a heat transfer fluid to the first cooling plate and the second cooling plate and an inlet to receive the heat transfer fluid from the first cooling plate and the second cooling plate.
申请公布号 WO2011136974(A2) 申请公布日期 2011.11.03
申请号 WO2011US32992 申请日期 2011.04.19
申请人 APPLIED MATERIALS, INC.;LEE, JARED, AHMAD;CRUSE, JAMES, P.;NGUYEN, ANDREW;COBB, CORIE, LYNN;XU, MING;SALINAS, MARTIN, JEFF;SHEYNER, ANCHEL 发明人 LEE, JARED, AHMAD;CRUSE, JAMES, P.;NGUYEN, ANDREW;COBB, CORIE, LYNN;XU, MING;SALINAS, MARTIN, JEFF;SHEYNER, ANCHEL
分类号 H01L21/02;H01L21/205 主分类号 H01L21/02
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