| 摘要 |
A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.
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