| 摘要 |
An electronic device 10 includes a layered piezoelectric element 20 and a driven member 30. The driven member 30 is bonded to the top surface 20a of the layered piezoelectric element 20 by means of an epoxy resin adhesive S. The piezoelectric element 20 includes a side electrode 24 on one side surface of the element, which is one of the outer surfaces of the element 20. The piezoelectric element 20 includes, in the vicinity of the upper end portion of the side surface, a dam portion 28 formed of a material for preventing epoxy bleed out of the adhesive S. Therefore, even when the epoxy bleed out of the adhesive S occurs, a bled-out portion of the components of the adhesive S does not reach the side electrode 24. Thus, when the side electrode is connected to an external circuit by, for example, soldering, reduction in the connection strength or similar problems can be avoided.
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