发明名称 METHOD FOR PRODUCING WAFER LENS MEMBER, METHOD FOR PRODUCING IMAGE-CAPTURING LENS, METHOD FOR PRODUCING IMAGE-CAPTURING MODULE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE MOUNTED WITH IMAGE-CAPTURING MODULE
摘要 <p>Disclosed is a method for producing an image-capturing lens, wherein the method is provided with a curing step for filling and curing a photo curable resin between a molding die having a lens-forming molding surface and one surface of a substrate, a releasing step for releasing, and a post-curing step for post-curing the lens portion formed on the substrate to progress the curing of the resin. The post-curing step is provided with a first post-curing step performed at a temperature from the glass-transition temperature (Tg) of the resin to Tg+100°C for 0.5 to 2 hours, and a second post-curing step performed at a temperature lower than the Tg and lower than the post-curing temperature in the first post-curing step by 25°C or more for 3 to 6 hours.</p>
申请公布号 WO2011136139(A1) 申请公布日期 2011.11.03
申请号 WO2011JP59916 申请日期 2011.04.22
申请人 KONICA MINOLTA OPTO, INC.;HARA, AKIKO 发明人 HARA, AKIKO
分类号 B29C39/10;B29C39/38;B29L11/00;G02B3/00;G02B7/02;G02B13/00;G02B13/18;H04N5/225 主分类号 B29C39/10
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