| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent noise due to the damage of an optical detection part on the occasion of packaging. <P>SOLUTION: A plurality of photodiodes 4 are formed in an array on the side of the plane of incidence of light to be detected of an n type silicon substrate 3, and piercing wiring 8 which pierces the incidence plane side and the back side thereof is formed for the photodiodes 4. The photodiode array 1 thus constituted is provided with a transparent resin film 6 which covers the area where the photodiodes 4 are formed and transmits the light to be detected. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
