发明名称 EMBEDDED MEMORY CELL AND METHOD OF MANUFACTURING SAME
摘要 <p>An embedded memory cell includes a semiconducting substrate (110), a transistor (120) having a source/drain region (121) at least partially embedded in the semiconducting substrate, and a capacitor (130) at least partially embedded in the semiconducting substrate. The capacitor includes a first electrode (131) and a second electrode (132) that are electrically isolated from each other by a first electrically insulating material (133). The first electrode is electrically connected to the semiconducting substrate and the second electrode is electrically connected to the source/drain region of the transistor.</p>
申请公布号 EP2382664(A2) 申请公布日期 2011.11.02
申请号 EP20090836961 申请日期 2009.12.17
申请人 INTEL CORPORATION 发明人 KAVALIEROS, JACK T.;MUKHERJEE, NILOY;DEWEY, GILBERT;SOMASEKHAR, DINESH;DOYLE, BRIAN S.
分类号 H01L27/108;H01L21/8242;H01L29/66;H01L49/02 主分类号 H01L27/108
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