发明名称 PRINTED WIRING BOARD
摘要 This suggests a printed wiring board, where insulation layers and conductive circuits are laminated alternately, the cross-section of each conductive circuit is rectangular, and when the upper conductive circuit space between adjacent conductive circuits of the PWB is referred to as (W1) and the lower conductive circuit space as (W2), the difference between those spaces with reference to the conductive circuit thickness (T) satisfies the formula 0.10T‰¦|W1 - W2|‰¦0.73T. The above-described structure can suppress crosstalk and delayed signal transmission and prevent malfunctions of ICs even when high-speed driven ICs are mounted.
申请公布号 EP1835790(B1) 申请公布日期 2011.11.02
申请号 EP20050819875 申请日期 2005.12.15
申请人 IBIDEN CO., LTD. 发明人 NAKAI, TORU;TAMAKI, MASANORI
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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