| 摘要 |
<p>This invention relates to a liquid epoxy resin composition which shows excellent adhesiveness, low content of ionic contaminants and good storage stability and is particularly suitable as a material for flip chip packaging and adhesion of substrates. The composition comprises epoxy resin (A) which is liquid at normal temperatures and comprises epoxy resin (A1) represented by the following formula (1) and epoxy resin (A2) having two or more glycidyl ether groups in the molecule, hardeners (B) selected from one kind or more of curing agents and curing catalysts as main ingredients and 0.1-5 wt % of solvent (C) and the content of epoxy resin (A1) in epoxy resin (A) is in the range of 5-75 wt %; at least one of the groups R<SUB>1</SUB>-R<SUB>5 </SUB>in formula (1) is a group represented by the following general formula (2) and the remainder is hydrocarbon groups containing 1-6 carbon atoms or hydrogen atoms.</p> |
