| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating substrate containing a glass-cloth which can be given stiffness to a slightly piled, low-density multilayered wiring board, and can manufacture a multilayered wiring board which is free from deformation like a camber under severe conditions like inside engine room and good in inter-layer adhesion. SOLUTION: The insulating substrate containing glass-cloth consists of a glass-cloth layer 10 overlying both sides with insulating layers 20 of a thermoplastic resin composition, wherein the glass-cloth is impregnated with a blend of an alkenyl phenol compound and a maleimide, and cured. COPYRIGHT: (C)2007,JPO&INPIT |
