COMPOSITIONS FOR FORMING A PASSIVATION LAYER AND METHODS OF FORMING A PASSIVATION LAYER USING THE SAME

摘要

PURPOSE: A composition for forming a passivation layer is provided to ensure excellent thermal, chemical, and electrical properties and to effectively prevent the defects of a semiconductor device by forming a passivation layer. CONSTITUTION: A composition for forming a passivation layer comprises: 30-60 weight% of a mixed polymer resin formed by mixing polyamic acids with polyhydroxy amides; 3-10 weight% of a photoactive compound; 2-10 weight% of a cross-linking agent; and the remaining organic solvent. A method for preparing a passivation layer comprises the steps of: forming a coating layer(110) by applying the composition for forming a passivation layer to an object(100); forming a coating layer pattern by removing a part of the coating layer; and baking the coating layer pattern.