| 摘要 |
<p>PURPOSE: A semiconductor integrated circuit is provided to minimize the area of a semiconductor chip by reducing reservoir capacitor included in the semiconductor chip. CONSTITUTION: A chip through via passes through a semiconductor chip(310). An insulator(330) electrically divides the chip trough via. The divided chip through vias interface different signals. The chip through via is a TSV(Through Silicon Via)(320).</p> |
