| 摘要 |
<p>The structure is assembled from an encapsulation base 10, light emitting diode (LED) chips 12 and transparent encapsulation material 14. The LED chips 12 are mounted on an encapsulation region of the base 10, after which the transparent encapsulation material 14 is used to overlay the LED chips. Accordingly, the light rays produced by the LED chips 12 can be emitted from the side areas. When the LED chips 12 are mounted and joined to the base 10, then the brightness at the connected areas is maintained, thus eliminating uneven brightness. The encapsulation material is formed from silicone which contains phosphor.</p> |
