发明名称 Semiconductor device with a drain region underlying a gate contact pad
摘要 The present invention relates to a semiconductor device and has an object to enhance a di / dt tolerance and a dV / dt tolerance without increasing an ON resistance. In order to achieve the object described above, an underpad drain region is provided in an upper main surface of a semiconductor substrate (1) under a gate pad (12), a conductive layer (10) connected to said gate pad (12) being buried in an insulating layer (7) so as to be closer to said upper main surface than said gate pad.
申请公布号 EP2383790(A1) 申请公布日期 2011.11.02
申请号 EP20110174242 申请日期 2001.04.04
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HATADE, KAZUNARI;HISAMOTO, YOSHIAKI
分类号 H01L29/78;H01L21/336;H01L27/00;H01L29/06;H01L29/08;H01L29/10;H01L29/40;H01L29/423;H01L29/739 主分类号 H01L29/78
代理机构 代理人
主权项
地址