摘要 |
A semiconductor electronic device (1) is disclosed, which comprises a die (2) of semiconductor material and a support (3), the die (2) of semiconductor material including an integrated electronic circuit and a plurality of contact pads (6) associated with the electronic circuit and connected electrically to the support (3) by wire leads (4), characterized in that each contact pad of said plurality of contact pads (6) comprises a lower layer (7) of aluminium, copper, or alloys thereof, and an upper layer comprising at least one film (9) of a metal and/or metallic alloy selected from a group comprising nickel, palladium, and alloys thereof, and being deposited by an electroless chemical process. <IMAGE> |