| 摘要 |
The light emitting device (100) includes a resin package (20) provided with a recess portion (27), a light emitting element (10) housed in the recess portion (27), a sealing member (30) filled in the recess portion (27) and covering the light emitting element (10), in which the resin package (20) has leads (22a, 22b) which are not exposed two opposing outer side surfaces (20d) but are exposed from two opposing outer side surfaces which are perpendicular with the outer side surfaces (20d) , a resin portion (25) is integrally molded with the leads (22a, 22b), the upper surfaces of the leads (22a, 22b) are exposed from the resin portion 25 to the inner bottom surface (27a) of the recess portion (27), and the top surfaces of the leads (22a, 22b) are formed such that the region constituting the inner bottom surface of the recess portion (27) are lower than their peripheral region. |
