| 摘要 |
A checking device for fixing substrate and a printing device are disclosed which are used to discriminate the provision state of cream solder by surely extracting the solder provided on a mounting substrate. The mounting substrate W which is irradiated with infrared 733 and visible light 734 at small incident angles, the reflected light from the infrared and the visible light from the mounting substrate W is used for imaging, and the arrangement state of the cream solder is discriminated based on the imaging result. The situation that the central portion of the solder is shot to be brighter can be prevented by the infrared, and the solder and the pad can be distinguished by imaging the pad to be sufficiently brighter than the solder using the visible light having the a small incident anglewhich irradiates along with the infrared. |
