发明名称 |
REGENERATING PROCESS AND REGENERATING SYSTEM TOREGENERATE WASTE SLURRY FROM WAFERMANUFACTURING PROCESS |
摘要 |
PURPOSE: A method for regenerating a dispersing material in waste slurry generated from a wafer manufacturing process and an apparatus for the same are provided to improve the regenerating efficiency of the waste slurry. CONSTITUTION: A dispersing material and a polishing material are dispersed in a waste slurry generated from a wafer manufacturing process(S100). The dispersing material and the polishing material are defined and extracted in a centrifugal separating method(S200). Solid powder is eliminated from the extracted dispersing material in a filtering process(S300). Moisture contained in the dispersing material is eliminated by heating the dispersing material in a moisture eliminating process(S400). Remaining solid powder is eliminated(S500). |
申请公布号 |
KR101078818(B1) |
申请公布日期 |
2011.11.02 |
申请号 |
KR20110028633 |
申请日期 |
2011.03.30 |
申请人 |
SILFINE CO., LTD. |
发明人 |
LIM, SEOUNG HYUN;LEE, KI HO;SIM, MIN SEOK |
分类号 |
B09B3/00;B04B3/00;B07B7/08;H01L21/00 |
主分类号 |
B09B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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