发明名称 |
Package substrate with a cavity, semiconductor package and fabrication method thereof |
摘要 |
A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.
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申请公布号 |
US8049114(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20090408719 |
申请日期 |
2009.03.22 |
申请人 |
UNIMICRON TECHNOLOGY CORP. |
发明人 |
CHEN KUO-CHING;CHEN TSUNG-YUAN;CHIEN CHENG-PIN |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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