发明名称 |
Process of forming ultra thin wafers having an edge support ring |
摘要 |
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.
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申请公布号 |
US8048775(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20070880455 |
申请日期 |
2007.07.20 |
申请人 |
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED |
发明人 |
FENG TAO;TAI SUNG-SHAN |
分类号 |
H01L21/30;H01L21/46 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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