METHODS OF FORMING SEMICONDUCTOR ELEMENTS USING MICRO-ABRASIVE PARTICLE STREAM

摘要

PURPOSE: A method for forming a semiconductor element by spraying fine abrasive particles is provided to reduce the size of a system by arranging the system in a single housing. CONSTITUTION: A semiconductor element with the front and the rear is provided. A first opening(30) is extended from the rear to the front of the semiconductor element by spraying fine abrasive particles. A second opening(40) is extended from the first opening to the bottom of the conductive pad exposed from the front. A connection contact and a conductive interconnection unit connected to the conductive contact are formed.