发明名称 |
Integrated circuit package having integrated faraday shield |
摘要 |
A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate (110), the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.
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申请公布号 |
US8049119(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20100775875 |
申请日期 |
2010.05.07 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BEDDINGFIELD STANLEY C;DROUARD JEAN-FRANCOIS |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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