| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip with an adhesive layer, capable of forming an adhesive layer transfer sheet which is used for manufacturing a semiconductor chip with an adhesive layer, without having to use a photolithographic method, and moreover, forming with a roll-to-roll method. <P>SOLUTION: The method for manufacturing a semiconductor chip 100, provided with an adhesive layer 12b formed in a region surrounded by bumps 33 with peripheral arrangement, includes carrying out a half-cut processing to a laminate formed, by holding an adhesive layer 12b between a base film 10b and a cover film, from a side of the base film 10b; removing the adhesive layer 12b and the base film 10b, corresponding to a region of a semiconductor element formed in a semiconductor wafer which is not surrounded by the bumps 33 with the peripheral arrangement, from the top surface of the cover film; and using an adhesive layer transfer sheet, obtained by laminating a carrier film on a surface of a side of the base film 10b of the laminate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
