PHOTOSENSITIVE RESIN COMPOSITION, ADHESIVE FILM, AND LIGHT RECEIVING DEVICE
摘要
<p>54An object of the present invention is to provide a photosensitive resin composition which leaves a small amount of resin residues after patterning by light-exposure and development and can reduce5 condensation between the semiconductor wafer and the transparent substrate under a high temperature and high humidity environment, an adhesive film made of the photosensitive resin composition and a light-receiving device including the adhesive film. The photosensitive resin composition of the present invention contains10 an alkali soluble resin (A) , a photopolyrnerization initiator (B) and a compound (C) having a phenolic hydroxyl group and a carboxyl group.FIGURE 1</p>
