| 发明名称 |
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING |
| 摘要 |
<p>A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight Mw of 6000 g/mol or more.</p> |
| 申请公布号 |
SG174265(A1) |
申请公布日期 |
2011.10.28 |
| 申请号 |
SG20110064094 |
申请日期 |
2010.03.29 |
| 申请人 |
BASF SE |
发明人 |
ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;EMNET, CHARLOTTE;HAAG, ALEXANDRA;MAYER, DIETER |
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