FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEGRATED FILM FOR BACK SURFACE OF SEMICONDUCTOR, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

摘要

The disclosed film for the back surface of a flip-chip semiconductor is to be formed on the back surface of a semiconductor element that has been flip-chip connected onto an object, wherein the amount of shrinkage of the flip-chip-semiconductor back-surface film due to heat curing is from 2 vol% to 30 vol% of the total volume of the film before heat curing. Because the disclosed flip-chip-semiconductor back-surface film is formed on the back surface of a semiconductor element that has been flip-chip connected onto an object, the film serves to protect the semiconductor element. Further, because the amount of shrinkage of the flip-chip-semiconductor back-surface film due to heat curing is greater than or equal to 2 vol% of the total volume of the film before heat curing, the film can effectively inhibit or prevent the semiconductor element from warping at the time of flip-chip connecting the semiconductor element onto the object.