SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT, ELECTRONIC CIRCUIT MODULE, AND METHOD FOR MANUFACTURING OF SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate with a built-in electronic component, which is thinner than the conventional one.SOLUTION: The substrate 100 with the built-in electronic component includes: a core substrate 10 where a storage part 4 is formed on at least one main surface; the electronic component 6 fixed to the bottom surface of the storage part 4; a resin layer 7 formed on the main surface of the core substrate 10; and in-resin-layer conductive vias 8a, 8b formed by penetration through the resin layer 7.