| 摘要 |
PROBLEM TO BE SOLVED: To remove a part having a bottom electrode without thermally damaging it.SOLUTION: In the initial state S10, the part 21 having the bottom electrode with a BGA (Ball grid array) 31 is attached to a substrate 10. A heat transfer material 41 such as low melting point solder is allowed to fill a gap between the substrate 10 and the part 21 having the bottom electrode (S11), and the heat transfer material 41 and the BGA 31 serving as the bottom electrode are heated (S12). The heat transfer material 41 and the BGA 31 are melted by the heating, thereby the part 21 having the bottom electrode is removed from the substrate 10 (S13). |
