发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can reduce unevenness of the thickness of an external electrode.SOLUTION: The method of manufacturing an electronic component includes a step of preparing an element body 18, a step of preparing a resin sheet 30, a step of coating the element body with conductive paste 34, a step of sticking the resin sheet to the conductive paste, a step of deforming a part of the resin sheet stuck to the conductive paste along the element body, and a step of removing the resin sheet.
申请公布号 JP2011216539(A) 申请公布日期 2011.10.27
申请号 JP20100080826 申请日期 2010.03.31
申请人 TDK CORP 发明人 INOUE YUKARI;KITAGAMI MASATOSHI;TANIGUCHI SUSUMU;YANAGIDA MIYUKI;ABE TOSHIYUKI
分类号 H01G4/12;H01F27/29;H01G4/252;H01G4/30;H01G13/00 主分类号 H01G4/12
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