发明名称 OLEFINIC RESIN COMPOSITION AND HEAT-RESISTANT OLEFINIC RESIN MOLDING USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an olefinic resin composition for ionizing radiation crosslinking which excels in heat resistance.SOLUTION: The olefinic resin composition includes: an olefinic resin in which ionizing radiation crosslinking is possible; and a crosslinking agent consisting of a monomer and/or an oligomer which performs compatibility or dispersion of at least 5 volume% with the olefinic resin and has a double bond. A molding obtained by carrying out ionizing radiation crosslinking of the olefinic resin composition is excellent in heat resistance, and can be suitably used as a back surface protective sheet of a solar cell module, for example.
申请公布号 JP2011213858(A) 申请公布日期 2011.10.27
申请号 JP20100083282 申请日期 2010.03.31
申请人 DAINIPPON PRINTING CO LTD 发明人 SHIODA SATOSHI;TAKEICHI HIROSHI;MORIYAMA TAKESHI
分类号 C08J3/24 主分类号 C08J3/24
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