发明名称 THERMOSETTING COMPOSITION
摘要 Disclosed is a resin composition that enables a drying step after a dip-coating step of pre-preg and laminate press-molding to be conducted at a low temperature and in a short period of time, and that can maintain the storage stability of the pre-preg. The resin composition contains: an imidazole compound (A) represented by the belowmentioned formula (I); an epoxy compound (B); and a cyanate compound (C1) or a BT resin (C2). (In the formula: R1 and R2 each independently represent an alkyl group having a carbon number of 3-18, an alkenyl group having a carbon number of 3-18, an alkoxyl group having a carbon number of 3-18, or a substituted or unsubstituted aromatic substituent group having a carbon number of 6-14; and R3 represents hydrogen, an alkyl group having a carbon number of 1-18, an alkenyl group having a carbon number of 2-18, an alkoxyl group having a carbon number of 1-18, a substituted or unsubstituted aromatic substitutent group having a carbon number of 6-14, or a halogen group.)
申请公布号 WO2011132674(A1) 申请公布日期 2011.10.27
申请号 WO2011JP59627 申请日期 2011.04.19
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC.;MABUCHI YOSHINORI;SOGAME MASANOBU;ARII KENJI;OTSUKA HAJIME;FUKASAWA EMI 发明人 MABUCHI YOSHINORI;SOGAME MASANOBU;ARII KENJI;OTSUKA HAJIME;FUKASAWA EMI
分类号 C08G59/68;B32B15/08;C08J5/24;C08L63/00 主分类号 C08G59/68
代理机构 代理人
主权项
地址