发明名称 POLYMER THICK FILM ENCAPSULANT AND ENHANCED STABILITY PTC CARBON SYSTEM
摘要 <p>The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, inparticular, in PTC heater circuitry in mirror heater and seat heater applications.</p>
申请公布号 WO2011133614(A1) 申请公布日期 2011.10.27
申请号 WO2011US33149 申请日期 2011.04.20
申请人 E. I. DU PONT DE NEMOURS AND COMPANY;ARANCIO, VINCE;DORFMAN, JAY, ROBERT 发明人 ARANCIO, VINCE;DORFMAN, JAY, ROBERT
分类号 C08L27/16;B60N2/56;C08L33/12;C09D127/16;H01C1/034;H01C7/02;H05B3/84 主分类号 C08L27/16
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