| 发明名称 |
MULTILEVEL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING SAME |
| 摘要 |
A multilevel interconnect structure for a semiconductor device includes an intermetal dielectric layer with funnel-shaped connecting vias. The funnel-shaped connecting vias are provided in connection with systems exhibiting submicron spacings. The architecture of the multilevel interconnect structure provides a low resistance connecting via. |
| 申请公布号 |
US2011260332(A1) |
申请公布日期 |
2011.10.27 |
| 申请号 |
US201113091330 |
申请日期 |
2011.04.21 |
| 申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
DI FRANCO ANTONIO;CRISTOFALO SILVIO;BONIFACIO MARCO |
| 分类号 |
H01L23/522;H01L21/306;H01L21/3105;H01L21/311 |
主分类号 |
H01L23/522 |
| 代理机构 |
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