发明名称 High Performance Non-Planar Semiconductor Devices with Metal Filled Inter-Fin Gaps
摘要 A non-planar semiconductor transistor device includes a substrate layer. Conductive channels extend between corresponding source and drain electrodes. A gate stack extending in a direction perpendicular to the conductive channels crosses over the plurality of conductive channels. The gate stack includes a dielectric layer running along the substrate and the plurality of conductive channels and arranged with a substantially uniform layer thickness, a work-function electrode layer covers the dielectric layer and is arranged with a substantially uniform layer thickness, and a metal layer, distinct from the work-function electrode layer, covers the work-function electrode layer and is arranged with a substantially uniform height with respect to the substrate such that the metal layer fills a gap between proximate conductive channels of the plurality of conductive channels.
申请公布号 US2011260257(A1) 申请公布日期 2011.10.27
申请号 US20100764762 申请日期 2010.04.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JAGANNATHAN HEMANTH;KANAKASABAPATHY SIVANANDA
分类号 H01L27/092;H01L27/088 主分类号 H01L27/092
代理机构 代理人
主权项
地址