发明名称 Circuit board with buried circuit pattern
摘要 A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
申请公布号 US2011259627(A1) 申请公布日期 2011.10.27
申请号 US201113067883 申请日期 2011.07.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JUNG HOE-KU;YOO JE-GWANG;KANG MYUNG-SAM;KIM JI-EUN;PARK JEONG-WOO;PARK JUNG-HYUN
分类号 H05K1/09;H05K1/11 主分类号 H05K1/09
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