发明名称 |
Circuit board with buried circuit pattern |
摘要 |
A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
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申请公布号 |
US2011259627(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113067883 |
申请日期 |
2011.07.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG HOE-KU;YOO JE-GWANG;KANG MYUNG-SAM;KIM JI-EUN;PARK JEONG-WOO;PARK JUNG-HYUN |
分类号 |
H05K1/09;H05K1/11 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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