SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGE PROCESS

摘要

A semiconductor package structure and a package process are provided, wherein a lower surface of a die pad of a leadframe is exposed by an encapsulant so as to improve the heat dissipation efficiency of the semiconductor package structure. In addition, two chips are disposed at the same sides of the leadframe and the end portion of each of leads bonding to the upper chip is encapsulated by the encapsulant such that the scratch on the lead tips in wire bonding and die attach steps can be prevented and thus the wire bondability can be enhanced.