COMPOSITION FOR FORMATION OF LITHOGRAPHIC RESIST UNDERLAYER FILM WHICH CONTAINS RESIN CONTAINING POLYIMIDE STRUCTURE

摘要

Disclosed is a resist underlayer film formation composition for forming a resist underlayer film having heat resistance and also having hard mask properties. Specifically disclosed are: a resist underlayer film formation composition which contains a polymer comprising a unit structure represented by formula (1) (wherein R1 represents a tetravalent organic group having a fluorene structure; and R2 represents a bivalent organic group which may have a fluorene structure), a unit structure represented by formula (2) (wherein R1 represents a tetravalent organic group having a fluorene structure; and R2 represents a bivalent organic group which may have a fluorene structure), or a combination of the unit structures; and a resist underlayer film formation composition as mentioned above, wherein R2 represents a bivalent organic group having a fluorene structure.