Method for forming active optical connection e.g. active optical cable with photo diode and three-dimensional light deflection unit to transmit data between CPU and memory in computer, involves removing substrate from positioning machine

摘要

The method involves arranging a support substrate (3) into a highly precise repeatable positioning machine i.e. flip chip machine, transverse to a beam direction (2a). An optoelectronic element (2) is mounted on the substrate, such that light beam of the element is aligned vertically vertical away from the substrate. A curable, malleable mass i.e. UV-curable mass, is applied over the optoelectronic element. The malleable mass is moved with the machine to form a three-dimensional light deflection unit molding i.e. polydimethylsiloxane molding. The substrate is removed from the machine. The light deflection unit is made of polymerized material. The support substrate is a printed circuit or a multi chip module. An independent claim is also included for an active optical connection with an optoelectronic element and a light deflection unit to turn light back between the element and a light guard.