| 摘要 |
PROBLEM TO BE SOLVED: To provide a fine powder of silver-plated copper, which has an ultrathin plating layer of silver formed on the surface of an ultrafine powder of copper.SOLUTION: The fine powder of silver-plated copper is a fine powder of copper having the surface plated with silver, in which the weight of silver is 1-25 mass%, the particle diameter (D50) is smaller than 1 μm, at which the cumulative weight measured with a laser-diffraction scattering type grain-size distribution method reaches 50%, and the thickness of the silver plating film is 0.1 nm to 0.2 μm. |
