发明名称 METHOD FOR BREAKING AND CUTTING LASER SCRIBE
摘要 PROBLEM TO BE SOLVED: To provide a method for breaking and cutting a laser scribe, capable of achieving the laser scribe with high accuracy.SOLUTION: The method for breaking and cutting the laser scribe for forming scribes 21, 22 in a lattice shape by applying laser beam of a plurality of rows along the first direction F and the second direction F orthogonal to each other of a substrate 2 of the rectangular shape in plan view, and for breaking and cutting the substrate 2 includes: a scribe pretreatment step of tightly arranging reinforcing and holding members 3 on a side edge in a vicinity of the position for forming a first row 211 before forming the scribes 21, 22 by applying laser beam of a plurality of rows to the substrate 2; a first scribe step of forming the scribe 21 by applying laser beam to the first row 211 to the n-th row parallel to the first direction F in the order closer to the reinforcing and holding member 3; and a second scribe step of forming the scribe 22 by applying laser beam to the first row 221 to the m-th row parallel to the second direction S from the fist row 211 to the n-th row in which the scribe 21 is formed in the first scribe step.
申请公布号 JP2011212741(A) 申请公布日期 2011.10.27
申请号 JP20100085810 申请日期 2010.04.02
申请人 SEIKO EPSON CORP 发明人 TAIRA TOSHIYUKI;HARA KAZUHIRO;NAGATA TETSUAKI;SAITO MAKOTO;SHIRAKAWA TOMOHISA
分类号 B23K26/00;B28D1/24;B28D5/00;C03B33/09;C30B29/18;C30B33/00 主分类号 B23K26/00
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