发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device suppressing degradation of electric characteristics of a transistor due to electric field concentration onto an upper corner part of an element separation groove formed in a semiconductor substrate.SOLUTION: The method includes a step of forming the element separation groove 2 having a crystal orientation different from that of a surface of the semiconductor substrate 1 in the semiconductor substrate 1, a step of depositing a metal 3 accelerating generation of an oxygen radical or a film containing the metal 3 on the semiconductor substrate 1, a step of oxidizing the semiconductor substrate 1, and a step of removing the metal or the metal-containing film.
申请公布号 JP2011216719(A) 申请公布日期 2011.10.27
申请号 JP20100084347 申请日期 2010.03.31
申请人 TOSHIBA CORP 发明人 SHIMIZU TAKASHI;ARAYASHIKI YUSUKE
分类号 H01L21/76;H01L27/08;H01L29/78 主分类号 H01L21/76
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