| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability and manufacturing yield of a solid-state image pickup element without increasing manufacturing cost.SOLUTION: The solid-state image pickup element in which photoelectric conversion parts including a pixel electrode film 125, a counter electrode film 131 opposing the pixel electrode film 125, and a light receiving layer 130 interposed between the pixel electrode film 125 and the counter electrode film 131 are arranged in a two dimensional array above a semiconductor substrate 121 includes: a signal reading circuit provided to the semiconductor substrate 121 corresponding to each photoelectric conversion part and reading a signal corresponding to a charge amount generated in the light receiving layer 130 and moved to the pixel electrode film 125; and test terminals 114a, b arranged outside a region where the pixel electrode film 125 is placed and testing the photoelectric conversion part formed on the same plane with the same material as the pixel electrode film 125. The test terminals 114a, b tests the light receiving layer 130 in a stage in the middle of manufacturing the solid-state image pickup element, and continuation of following manufacturing steps is stopped if it is determined to be faulty. |
