| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a semiconductor wafer, which facilitates peeling off a dicing sheet after finishing a dicing process and can sharply reduce contamination adhesion, even in an apparatus for bonding a dicing sheet directly to the underside of a wafer.SOLUTION: The adhesive sheet for processing the semiconductor wafer includes a radiotransparent resin base film and an adhesive layer formed on the top of the resin base film. The adhesive layer is configured by a layer using a radiation curable resin composition which contains 1-300 pts.mass of a compound which has at least two photopolymerizable carbon-carbon double bonds in a molecule and of which weight average molecular weight is ≤10,000, per 100 pts.mass of base resin, and 0.1-10 pts.mass of a photopolymerization initiator of which the weight average molecular weight converted by using polystyrene as a standard substance by a gel permeation chromatographic method is<1,000. |
