| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite glass epoxy substrate, along with a metal multilayer substrate using the same, capable of satisfying such opposing demands for resin substrate flatness and wiring pattern adhesion strength, as required for fine wiring pattern formation using a rigid resin substrate.SOLUTION: The composite glass epoxy substrate, along with the metal multilayer substrate using the same, includes components as follows: (a) pyromellitic acid dianhydride (PMDA), (b) bicyclo octene tetracarboxylic acid dianhydride (BCD) as acid dianhydrides, and (c) at least 4,4'-diamino diphenylether (DADE) or 3,4'-diamino diphenylether (mDADE) as biphenyl tetracarboxylic acid dianhydride (BPDA) or benzophenone tetracarboxylic acid dianhydride (BTDA) and aromatic diamine. These substrates further include a solvent soluble polyimide resin layer having a numerical average molecular weight of 10,000 to 35,000 obtained by composition by a three-stage addition reaction. |
