| 摘要 |
There are provided an apparatus for monitoring bonding surface bouncing, a wire bonding apparatus having the same, and a method for monitoring bonding surface bouncing. According to an aspect of the present invention, the apparatus for monitoring bonding surface bouncing includes a sensor measuring a capillary height in real time during bonding and a bouncing detector extracting a change rate of a capillary height from the capillary height measured in real time during a bonding performing period and detecting of whether bonding surface bouncing is present by comparing the extracted change rate with a set reference change rate.
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