发明名称 |
SURFACE-MOUNTABLE PIEZOELECTRIC DEVICES INCLUDING EUTECTIC-BONDED PACKAGES |
摘要 |
Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer.
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申请公布号 |
US2011260585(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113092871 |
申请日期 |
2011.04.22 |
申请人 |
NIHON DEMPA KOGYO CO., LTD. |
发明人 |
ICHIKAWA RYOICHI;MIZUSAWA SHUICHI |
分类号 |
H01L41/053 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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